METHOD FOR DICING SUBSTRATE

Details for Australian Patent Application No. 2003211763 (hide)

Owner HAMAMATSU PHOTONICS K.K.

Inventors FUKUMITSU, Kenshi; UCHIYAMA, Naoki; FUJII, Yoshimaro; FUKUYO, Fumitsugu

Pub. Number AU-A-2003211763

PCT Number PCT/JP03/02669

PCT Pub. Number WO2003/077295

Priority 2002-67289 12.03.02 JP

Filing date 6 March 2003

Wipo publication date 22 September 2003

International Classifications

H01L 021/301 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B23K 026/00 Working by laser beam, e.g. welding, cutting, boring

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 2002-67289 12.03.02 JP

30 October 2003 Application Open to Public Inspection

  Published as AU-A-2003211763

2 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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