METAL FOIL WITH RESIN AND METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD USING THE SAME AND METHOD FOR PRODUCTION THEREOF

Details for Australian Patent Application No. 2003211704 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors TAKAI, Kenji; SUEYOSHI, Takayuki

Pub. Number AU-A-2003211704

PCT Number PCT/JP03/02572

PCT Pub. Number WO2003/074268

Priority 2002-136052 10.05.02 JP; 2002-058162 05.03.02 JP; 2002-091885 28.03.02 JP

Filing date 5 March 2003

Wipo publication date 16 September 2003

International Classifications

B32B 015/08 Layered products essentially comprising metal - of synthetic resin

H05K 003/00 Apparatus or processes for manufacturing printed circuits

H05K 003/38 Apparatus or processes for manufacturing printed circuits - Improvement of the adhesion between the insulating substrate and the metal

Event Publications

24 July 2003 Complete Application Filed

  Priority application(s): 2002-136052 10.05.02 JP; 2002-058162 05.03.02 JP; 2002-091885 28.03.02 JP

23 October 2003 Application Open to Public Inspection

  Published as AU-A-2003211704

25 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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