SOLDER PASTE FORMULATIONS, METHODS OF PRODUCTION AND USES THEREOF

Details for Australian Patent Application No. 2003211032 (hide)

Owner HONEYWELL INTERNATIONAL INC.

Inventors LE, Kim-Chi; LALENA, John; WEISER, Martin

Pub. Number AU-A-2003211032

PCT Number PCT/US03/04374

PCT Pub. Number WO2003/068447

Priority 60/357,754 13.02.02 US

Filing date 12 February 2003

Wipo publication date 4 September 2003

International Classifications

B23K 035/22 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting - characterised by the composition or nature of the material

B23K 035/34 Rods, electrodes, materials, or media, for use in soldering, welding, or cutting - comprising compounds which yield metals when heated

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 60/357,754 13.02.02 US

2 October 2003 Application Open to Public Inspection

  Published as AU-A-2003211032

28 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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