Implantable sensor housing and fabrication methods

Details for Australian Patent Application No. 2003210709 (hide)

International Classifications

Event Publications

17 July 2003 Complete Application Filed

Priority application(s): 60/352,912 29.01.02 US

18 September 2003 Application Open to Public Inspection

Published as AU-B-2003210709

6 December 2007 Application Accepted

Published as AU-B-2003210709

3 April 2008 Standard Patent Sealed

27 August 2009 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.