SEMICONDUCTOR DIE PACKAGE WITH SEMICONDUCTOR DIE HAVING SIDE ELECTRICAL CONNECTION

Details for Australian Patent Application No. 2003210637 (hide)

Owner FAIRCHILD SEMICONDUCTOR CORPORATION

Inventors ESTACIO, Maria, Cristina, B.

Pub. Number AU-A-2003210637

PCT Number PCT/US03/02070

PCT Pub. Number WO2003/063248

Priority 60/351,587 22.01.02 US; 10/346,682 17.01.03 US

Filing date 21 January 2003

Wipo publication date 2 September 2003

International Classifications

H01L 027/10 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - including a plurality of individual components in a repetitive configuration

H01L 027/15 Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate - including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission

H01L 023/52 Details of semiconductor or other solid state devices - Arrangements for conducting electric current within the device in operation from one component to another

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 60/351,587 22.01.02 US; 10/346,682 17.01.03 US

18 September 2003 Application Open to Public Inspection

  Published as AU-A-2003210637

7 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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