EMISSIVITY-CHANGE-FREE PUMPING PLATE KIT IN A SINGLE WAFER CHAMBER

Details for Australian Patent Application No. 2003210542 (hide)

Owner APPLIED MATERIALS, INC.

Inventors JIN, Xiaoliang; WANG, Shulin; LUO, Lee; HO, Henry; CHEN, Steven, A.

Pub. Number AU-A-2003210542

PCT Number PCT/US03/01347

PCT Pub. Number WO2003/060189

Priority 10/051,651 15.01.02 US

Filing date 15 January 2003

Wipo publication date 30 July 2003

International Classifications

C23C 016/455 Chemical deposition or plating by decomposition - characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber

C23C 016/46 Chemical deposition or plating by decomposition - characterised by the method used for heating the substrate

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

C23C 016/44 Chemical deposition or plating by decomposition - characterised by the method of coating

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 10/051,651 15.01.02 US

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2003210542

30 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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