METHOD FOR OBTAINING METAL TO METAL CONTACT BETWEEN A METAL SURFACE AND A BONDING PAD.

Details for Australian Patent Application No. 2003209862 (hide)

Owner INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM

Inventors BANDA, Pedro; HO, Meng; WHELAN, Caroline

Pub. Number AU-A-2003209862

PCT Number PCT/BE03/00038

PCT Pub. Number WO2003/075340

Priority 60/361,525 01.03.02 US

Filing date 3 March 2003

Wipo publication date 16 September 2003

International Classifications

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 023/485 Details of semiconductor or other solid state devices

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 60/361,525 01.03.02 US

23 October 2003 Application Open to Public Inspection

  Published as AU-A-2003209862

18 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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