SMALL SCALE CHIP COOLER ASSEMBLY

Details for Australian Patent Application No. 2003209176 (hide)

Owner MARCONI COMMUNICATIONS, INC.

Inventors THIESEN, Jack, H.; WILLEN, Gary, S.; COSLEY, Michael, R.; FISCHER, Richard, L.

Pub. Number AU-A-2003209176

PCT Number PCT/US03/00457

PCT Pub. Number WO2003/060414

Priority 10/047,871 14.01.02 US

Filing date 8 January 2003

Wipo publication date 30 July 2003

International Classifications

F28F 007/00 Elements not covered by group , , or

F28F 003/12 Plate-like or laminated elements

F28D 015/00 Heat-exchange apparatus employing intermediate heat-transfer media or bodies

H05K 007/20 Constructional details common to different types of electric apparatus - Modifications to facilitate cooling, ventilating, or heating

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 10/047,871 14.01.02 US

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2003209176

30 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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