FLIP CHIP DIE BOND PADS, DIE BOND PAD PLACEMENT AND ROUTING OPTIMIZATION

Details for Australian Patent Application No. 2003208917 (hide)

International Classifications

Event Publications

17 July 2003 Complete Application Filed

Priority application(s): 60/354,069 31.01.02 US; 60/353,804 31.01.02 US; 60/354,070 31.01.02 US

18 September 2003 Application Open to Public Inspection

Published as AU-A-2003208917

14 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.