Method for manufacturing IC card by laminating a plurality of foils

Details for Australian Patent Application No. 2003208049 (hide)

International Classifications

Event Publications

17 July 2003 Complete Application Filed

Priority application(s): 10-2002-0077164 06.12.02 KR; 10-2003-0002592 15.01.03 KR; 10-2003-0002366 14.01.03 KR

5 August 2004 Application Open to Public Inspection

Published as AU-B-2003208049

5 April 2007 Application Accepted

Published as AU-B-2003208049

31 May 2007 Application for Amendment

The nature of the amendment is: Amend the invention title to read Dual-interface IC card by laminating a plurality of foils and method of same. Address for service in Australia - Hodgkinson McInnes Patents Level 21, 201 Elizabeth Street Sydney NSW 2000

13 September 2007 Standard Patent Sealed

10 September 2009 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This patent ceased under section 143(a), or Expired. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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