METHOD OF PROCESSING SEMICONDUCTOR WAFER

Details for Australian Patent Application No. 2003203231 (hide)

Owner DISCO CORPORATION

Inventors SEKIYA, Kazuma

Pub. Number AU-A-2003203231

PCT Number PCT/JP03/00302

PCT Pub. Number WO2003/065430

Priority 2002-18795 28.01.02 JP

Filing date 16 January 2003

Wipo publication date 2 September 2003

International Classifications

H01L 021/301 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

10 April 2003 Complete Application Filed

  Priority application(s): 2002-18795 28.01.02 JP

18 September 2003 Application Open to Public Inspection

  Published as AU-A-2003203231

14 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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