SEMICONDUCTOR WAFER PROTECTIVE MEMBER AND SEMICONDUCTOR WAFER GRINDING METHOD

Details for Australian Patent Application No. 2003202492 (hide)

Owner DISCO CORPORATION

Inventors YAJIMA, Koichi; KIMURA, Yusuke

Pub. Number AU-A-2003202492

PCT Number PCT/JP03/00126

PCT Pub. Number WO2003/060974

Priority 2002-004669 11.01.02 JP

Filing date 9 January 2003

Wipo publication date 30 July 2003

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

H01L 021/301 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

10 April 2003 Complete Application Filed

  Priority application(s): 2002-004669 11.01.02 JP

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2003202492

30 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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