ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME

Details for Australian Patent Application No. 2003202138 (hide)

International Classifications

Event Publications

3 April 2003 Complete Application Filed

Priority application(s): 2002-113690 16.04.02 JP; 2002-113651 16.04.02 JP; 2002-051643 27.02.02 JP; 2002-056319 01.03.02 JP; 2002-056324 01.03.02 JP; 2002-061268 07.03.02 JP; 2002-097737 29.03.02 JP

16 October 2003 Application Open to Public Inspection

Published as AU-A-2003202138

11 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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