HEAT-SENSITIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION

Details for Australian Patent Application No. 2003201913 (hide)

Owner API CORPORATION

Inventors KOBAYASHI, Kouji; TOKUSHIGE, Tadafumi; SUGA, Mamoru

Pub. Number AU-A-2003201913

PCT Number PCT/JP03/00069

PCT Pub. Number WO2003/060032

Priority 2002-39323 10.01.02 JP; 2002-116853 14.03.02 JP

Filing date 8 January 2003

Wipo publication date 30 July 2003

International Classifications

C09J 011/06 Features of adhesives not provided for in group , e.g. additives

C09J 007/02 Adhesives in the form of films or foils - on carriers

Event Publications

3 April 2003 Complete Application Filed

  Priority application(s): 2002-39323 10.01.02 JP; 2002-116853 14.03.02 JP

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2003201913

30 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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