EMBOSSING DIE FOR FABRICATING HIGH DENSITY INTERCONNECTS AND METHOD FOR ITS FABRICATION

Details for Australian Patent Application No. 2003201247 (hide)

Owner ELMICRON AG

Inventors DOMMANN, Alex; KUNDIG, Andreas; UGGOWITZER, Peter, J.; STEIERT, Philippe; STAUFERT, Gerhard

Pub. Number AU-A-2003201247

PCT Number PCT/CH03/00027

PCT Pub. Number WO2003/061356

Priority 60/349,643 17.01.02 US

Filing date 17 January 2003

Wipo publication date 30 July 2003

International Classifications

H05K 003/00 Apparatus or processes for manufacturing printed circuits

B22D 025/06 Special casting characterised by the nature of the product

B23P 015/24 Making specific metal objects by operations not covered by a single other subclass or a group in this subclass - dies

Event Publications

27 March 2003 Complete Application Filed

  Priority application(s): 60/349,643 17.01.02 US

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2003201247

7 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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