INTERLAYER CONNECTION STRUCTURE AND ITS BUILDING METHOD

Details for Australian Patent Application No. 2002367949 (hide)

Owner DAIWA CO., LTD.

Inventors YOSHIMURA, Eiji; KITAMURA, Mitsuhiko; SUYAMA, Ikuo Dana-Farber Cancer Institute, Inc. see Genzyme Corporation (21) 2003271378

Pub. Number AU-A-2002367949

PCT Number PCT/JP02/13049

PCT Pub. Number WO2003/098984

Priority 2002/146451 21.05.02 JP

Filing date 13 December 2002

Wipo publication date 2 December 2003

International Classifications

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

H05K 003/40 Apparatus or processes for manufacturing printed circuits - Forming printed elements for providing electric connections to or between printed circuits

Event Publications

15 January 2004 Complete Application Filed

  Priority application(s): 2002/146451 21.05.02 JP

29 January 2004 Application Open to Public Inspection

  Published as AU-A-2002367949

23 June 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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