APPARATUS AND METHOD FOR ELECTROPLATING A WAFER SURFACE

Details for Australian Patent Application No. 2002367224 (hide)

Owner KONINKLIJKE PHILIPS ELECTRONICS N.V.

Inventors DE KUBBER, Daan, L.

Pub. Number AU-A-2002367224

PCT Number PCT/IB02/05396

PCT Pub. Number WO2003/056609

Priority 01205083.7 24.12.01 EP

Filing date 12 December 2002

Wipo publication date 15 July 2003

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2002367224

4 September 2003 Complete Application Filed

  Priority application(s): 01205083.7 24.12.01 EP

16 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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