CONNECTION SUBSTRATE, MULTILAYER WIRING BOARD USING THE CONNECTION SUBSTRATE, SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFACTURING THEM

Details for Australian Patent Application No. 2002367203 (hide)

International Classifications

Event Publications

4 September 2003 Application Open to Public Inspection

Published as AU-A-2002367203

4 September 2003 Complete Application Filed

Priority application(s): 2001-391799 25.12.01 JP; 2002-126594 26.04.02 JP; 2002-230095 07.08.02 JP

16 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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