ADVANCED PROCESS CONTROL (APC) OF COPPER THICKNESS FOR CHEMICAL MECHANICAL PLANARIZATION(CMP) OPTIMIZATION

Details for Australian Patent Application No. 2002367053 (hide)

Owner ADVANCED MICRO DEVICES, INC.

Inventors CHRISTIAN, Craig, William; STICE, James, Clayton

Pub. Number AU-A-2002367053

PCT Number PCT/US02/28982

PCT Pub. Number WO2003/060990

Priority 10/044,641 10.01.02 US

Filing date 12 September 2002

Wipo publication date 30 July 2003

International Classifications

H01L 021/66 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof - Testing or measuring during manufacture or treatment

Event Publications

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2002367053

4 September 2003 Complete Application Filed

  Priority application(s): 10/044,641 10.01.02 US

30 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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