WAFER HANDLING APPARATUS AND METHOD

Details for Australian Patent Application No. 2002365591 (hide)

Owner DIAMOND SEMICONDUCTOR GROUP, LLC.

Inventors SIERADZKI, Manny; WHITE, Nicholas, R.

Pub. Number AU-A-2002365591

PCT Number PCT/US02/38228

PCT Pub. Number WO2003/046958

Priority 60/334,251 29.11.01 US

Filing date 27 November 2002

Wipo publication date 10 June 2003

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

14 August 2003 Complete Application Filed

  Priority application(s): 60/334,251 29.11.01 US

21 August 2003 Application Open to Public Inspection

  Published as AU-A-2002365591

12 August 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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