A WIREBOND STRUCTURE AND METHOD TO CONNECT TO A MICROELECTRONIC DIE

Details for Australian Patent Application No. 2002365137 (hide)

Owner INTEL CORPORATION

Inventors GLEIXNER, Robert; NAIK, Rajan; DANIELSON, Donald; PALUDA, Patrick

Pub. Number AU-A-2002365137

PCT Number PCT/US02/33568

PCT Pub. Number WO2003/056625

Priority 10/032,623 18.10.01 US

Filing date 17 October 2002

Wipo publication date 15 July 2003

International Classifications

H01L 023/00 Details of semiconductor or other solid state devices

Event Publications

31 July 2003 Complete Application Filed

  Priority application(s): 10/032,623 18.10.01 US

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2002365137

8 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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