MULTI-LAYERES WITH VIAS IN FILLED HOLES

Details for Australian Patent Application No. 2002364565 (hide)

Owner HONEYWELL ADVANCED CIRCUITS, INC.

Inventors DANE, Kevin; SCHULTZ, Steve; LOPAC, Mark; BACKEN, David

Pub. Number AU-A-2002364565

PCT Number PCT/US02/39893

PCT Pub. Number WO2003/051626

Priority 10/033,277 13.12.01 US

Filing date 13 December 2002

Wipo publication date 30 June 2003

International Classifications

B32B 003/24 Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form - characterised by an apertured layer, e.g. of expanded metal

H05K 003/42 Apparatus or processes for manufacturing printed circuits - Plated through-holes

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 10/033,277 13.12.01 US

28 August 2003 Application Open to Public Inspection

  Published as AU-A-2002364565

16 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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