Heated embossing and ply bonding process

Details for Australian Patent Application No. 2002363951 (hide)

International Classifications

Event Publications

17 July 2003 Complete Application Filed

Priority application(s): 10/025,190 19.12.01 US

2 October 2003 Application Open to Public Inspection

Published as AU-B-2002363951

15 May 2008 Application Accepted

Published as AU-B-2002363951

31 July 2008 Application for Amendment

The nature of the amendment is as shown in the statement(s) filed 15 May 2008. Address for service in Australia - Spruson & Ferguson Level 35 St Martins Tower 31 Market Street Sydney NSW 2000

11 September 2008 Standard Patent Sealed

4 December 2008 Amendment Made

The nature of the amendment is as shown in the statement(s) filed 15 May 2008 2003

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