HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD

Details for Australian Patent Application No. 2002363902 (hide)

Owner INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventors MAGERLEIN, John, Harold; PETRARCA, Kevin, Shawn; PURUSHOTHAMAN, Sampath; SAMBUCETTI, Carlos, Juan; VOLANT, Richard, Paul; WALKER, George, Frederick

Pub. Number AU-A-2002363902

PCT Number PCT/EP02/14911

PCT Pub. Number WO2003/060960

Priority 10/052,620 18.01.02 US

Filing date 19 December 2002

Wipo publication date 30 July 2003

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

17 July 2003 Complete Application Filed

  Priority application(s): 10/052,620 18.01.02 US

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2002363902

7 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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