METHOD OF FORMING COPPER INTERCONNECTIONS FOR SEMICONDUCTOR INTEGRATED CIRCUITS ON A SUBSTRATE

Details for Australian Patent Application No. 2002359994 (hide)

Owner GENITECH CO., LTD.

Inventors PARK, Hyung-Sang; KANG, Sang-Won

Pub. Number AU-A-2002359994

PCT Number PCT/KR02/02468

PCT Pub. Number WO2003/056612

Priority 10-2001-0086955 28.12.01 KR

Filing date 28 December 2002

Wipo publication date 15 July 2003

International Classifications

H01L 021/28 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

3 April 2003 Complete Application Filed

  Priority application(s): 10-2001-0086955 28.12.01 KR

4 September 2003 Application Open to Public Inspection

  Published as AU-A-2002359994

16 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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