HIGH CAPACITY MEMORY MODULE WITH BUILT-IN PERFORMANCE ENHANCING FEATURES

Details for Australian Patent Application No. 2002359532 (hide)

Owner HIGH CONNECTION DENSITY, INC.

Inventors MORIARTY, Sharon, L.; FAN, Zhineng; BROWN, Dirk, D.; LI, Che-Yu

Pub. Number AU-A-2002359532

PCT Number PCT/US02/38217

PCT Pub. Number WO2003/071378

Priority 10/077,057 19.02.02 US

Filing date 22 November 2002

Wipo publication date 9 September 2003

Event Publications

3 April 2003 Complete Application Filed

  Priority application(s): 10/077,057 19.02.02 US

9 October 2003 Application Open to Public Inspection

  Published as AU-A-2002359532

4 November 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002359533-IMPLANTABLE TRACKING AND MON- ITORING SYSTEM

2002359531-A THERMAL ANNEALING WITH RAPID THERMAL ANNEALING SYSTEM AND METHOD