HEATED FILLING DEVICE AND METHOD

Details for Australian Patent Application No. 2002357875 (hide)

Owner HONEYWELL ADVANCED CIRCUITS, INC.

Inventors PEDIGO, Jesse; MEYER, Timothy

Pub. Number AU-A-2002357875

PCT Number PCT/US02/40364

PCT Pub. Number WO2003/053623

Priority 10/026,135 20.12.01 US; 10/026,382 20.12.01 US

Filing date 17 December 2002

Wipo publication date 9 July 2003

International Classifications

B23K 001/00 Soldering, e.g. brazing, or unsoldering

B67D 005/62 -

B22D 039/00 Equipment for supplying molten metal in rations

B23K 031/02 Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups - relating to soldering or welding

Event Publications

3 April 2003 Complete Application Filed

  Priority application(s): 10/026,135 20.12.01 US; 10/026,382 20.12.01 US

2 October 2003 Application Open to Public Inspection

  Published as AU-A-2002357875

9 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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