MEASUREMENT OF METAL ELECTROPLATING AND SEED LAYER THICKNESS AND PROFILE

Details for Australian Patent Application No. 2002357225 (hide)

Owner TIMBRE TECHNOLOGIES, INC.

Inventors NUI, Xinhui; LANE, Lawrence; JAKATDAR, Nickhil

Pub. Number AU-A-2002357225

PCT Number PCT/US02/39987

PCT Pub. Number WO2003/050473

Priority 10/022,035 13.12.01 US

Filing date 13 December 2002

Wipo publication date 23 June 2003

International Classifications

G01B 011/00 Measuring arrangements characterised by the use of optical means

G01R 031/26 Arrangements for testing electric properties - Testing of individual semiconductor devices

Event Publications

27 March 2003 Complete Application Filed

  Priority application(s): 10/022,035 13.12.01 US

28 August 2003 Application Open to Public Inspection

  Published as AU-A-2002357225

2 September 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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