PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS THEREOF

Details for Australian Patent Application No. 2002355004 (hide)

Owner ASAHI KASEI KABUSHIKI KAISHA

Inventors MORI, Toru; ADACHI, Teruhiko

Pub. Number AU-A-2002355004

PCT Number PCT/JP02/11744

PCT Pub. Number WO2003/042758

Priority 2001-346280 12.11.01 JP

Filing date 11 November 2002

Wipo publication date 26 May 2003

International Classifications

G03F 007/027 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

G03F 007/004 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Photosensitive materials

H05K 003/00 Apparatus or processes for manufacturing printed circuits

Event Publications

20 March 2003 Complete Application Filed

  Priority application(s): 2001-346280 12.11.01 JP

24 July 2003 Application Open to Public Inspection

  Published as AU-A-2002355004

29 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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