METHOD FOR SUPPLYING SOLDER

Details for Australian Patent Application No. 2002354474 (hide)

Owner TAMURA CORPORATION

Inventors OHASHI, Yuji; ONOZAKI, Junichi; FURUNO, Masahiko; SAITO, Hiroshi; ANDOU, Haruhiko; SAKAMOTO, Isao; SHIRAI, Masaru

Pub. Number AU-A-2002354474

PCT Number PCT/JP02/13057

PCT Pub. Number WO2004/054339

Priority 2002-355373 06.12.02 JP

Filing date 13 December 2002

Wipo publication date 30 June 2004

International Classifications

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

H01L 021/60 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

20 March 2003 Complete Application Filed

  Priority application(s): 2002-355373 06.12.02 JP

5 August 2004 Application Open to Public Inspection

  Published as AU-A-2002354474

25 August 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

Legal

The information provided by the Site not in the nature of legal or other professional advice. The information provided by the Site is derived from third parties and may contain errors. You must make your own enquiries and seek independent advice from the relevant industry professionals before acting or relying on any information contained herein. Check the above data against the Australian Patent Office AUSPAT database.

Next and Previous Patents/Applications

2002354475-Crystals of bicalutamide and process for their production

2002354473-HEAT INSULATING MATERIAL FOR STICKING ON SKIN