EPOXY RESIN MOLDING MATERIAL FOR ENCAPSULATION AND ELECTRONIC COMPONENTS AND DEVICES

Details for Australian Patent Application No. 2002354468 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors HAYASHI, Tomohiro; MIYATA, Tomohiro; IKEZAWA, Ryouichi; ABE, Hidenori; FUJII, Masanobu

Pub. Number AU-A-2002354468

PCT Number PCT/JP02/12974

PCT Pub. Number WO2003/080726

Priority 2002-081363 22.03.02 JP; 2002-081347 22.03.02 JP; 2002-081386 22.03.02 JP

Filing date 11 December 2002

Wipo publication date 8 October 2003

International Classifications

C08L 063/00 Compositions of epoxy resins

H01L 023/29 Details of semiconductor or other solid state devices

C08K 003/38 Use of inorganic ingredients

C08K 005/50 Use of organic ingredients

C08K 005/521 Use of organic ingredients

Event Publications

20 March 2003 Complete Application Filed

  Priority application(s): 2002-081363 22.03.02 JP; 2002-081347 22.03.02 JP; 2002-081386 22.03.02 JP

13 November 2003 Application Open to Public Inspection

  Published as AU-A-2002354468

9 December 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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