STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS AND A METHOD OF MAKING THE SAME

Details for Australian Patent Application No. 2002353894 (hide)

Event Publications

20 March 2003 Complete Application Filed

Priority application(s): 09/938,686 30.10.01 US

10 July 2003 Application Open to Public Inspection

Published as AU-A-2002353894

15 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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