HIGH SPEED MULTI-LAYER PRINTED CIRCUIT BOARD VIA

Details for Australian Patent Application No. 2002352983 (hide)

Owner TERADYNE, INC.

Inventors GATELY, Ellen, M.; MCGRATH, Robert, A.; GAILUS, Mark, W.

Pub. Number AU-A-2002352983

PCT Number PCT/US02/38284

PCT Pub. Number WO2003/049511

Priority 10/007,689 04.12.01 US

Filing date 2 December 2002

Wipo publication date 17 June 2003

International Classifications

H05K 001/11 Printed circuits - Printed elements for providing electric connections to or between printed circuits

H05K 003/42 Apparatus or processes for manufacturing printed circuits - Plated through-holes

H05K 003/46 Apparatus or processes for manufacturing printed circuits - Manufacturing multi-layer circuits

Event Publications

20 March 2003 Complete Application Filed

  Priority application(s): 10/007,689 04.12.01 US

21 August 2003 Application Open to Public Inspection

  Published as AU-A-2002352983

19 August 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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