IMPROVING INTEGRATED CIRCUIT PERFORMANCE AND RELIABILITY USING A PATTERNED BUMP LAYOUT ON A POWER GRID

Details for Australian Patent Application No. 2002352885 (hide)

Owner SUN MICROSYSTEMS, INC.

Inventors BOBBA, Sudhakar; THORP, Tyler, J.; LIU, Dean; TRIVEDI, Pradeep, R.

Pub. Number AU-A-2002352885

PCT Number PCT/US02/37643

PCT Pub. Number WO2003/048981

Priority 09/997,452 29.11.01 US; 09/997,437 29.11.01 US; 09/997,471 29.11.01 US; 09/997,523 29.11.01 US; 09/997,844 29.11.01 US; 09/997,438 29.11.01 US

Filing date 25 November 2002

Wipo publication date 17 June 2003

International Classifications

G06F 017/50 Digital computing or data processing equipment or methods, specially adapted for specific functions - Computer-aided design

Event Publications

20 March 2003 Complete Application Filed

  Priority application(s): 09/997,452 29.11.01 US; 09/997,437 29.11.01 US; 09/997,471 29.11.01 US; 09/997,523 29.11.01 US; 09/997,844 29.11.01 US; 09/997,438 29.11.01 US

21 August 2003 Application Open to Public Inspection

  Published as AU-A-2002352885

12 August 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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