USING THE WAVE SOLDERING PROCESS TO ATTACH MOTHERBOARD CHIPSET HEAT SINKS

Details for Australian Patent Application No. 2002351683 (hide)

International Classifications

Event Publications

20 March 2003 Complete Application Filed

Priority application(s): 09/897,320 29.06.01 US

15 May 2003 Application Open to Public Inspection

Published as AU-A-2002351683

18 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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