INTEGRAL HEATSINK PLASTIC BALL GRID ARRAY

Details for Australian Patent Application No. 2002351670 (hide)

Owner CHIPPAC, INC.

Inventors KARNEZOS, Marcos; ZAHN, Bret; CARSON, Flynn

Pub. Number AU-A-2002351670

PCT Number PCT/US02/19078

PCT Pub. Number WO2003/003454

Priority 09/893,356 26.06.01 US

Filing date 12 June 2002

Wipo publication date 3 March 2003

International Classifications

H01L 023/10 Details of semiconductor or other solid state devices

H01L 023/34 Details of semiconductor or other solid state devices - Arrangements for cooling, heating, ventilating or temperature compensation

Event Publications

20 March 2003 Complete Application Filed

  Priority application(s): 09/893,356 26.06.01 US

15 May 2003 Application Open to Public Inspection

  Published as AU-A-2002351670

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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