POSITIVE RESIST COMPOSITION OF CHEMICAL AMPLIFICATION TYPE, RESIST COATED MATERIAL, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Details for Australian Patent Application No. 2002346237 (hide)

Owner TOKYO OHKA KOGYO CO., LTD.

Inventors NITTA, Kazuyuki; MIMURA, Takeyoshi; SHIMATANI, Satoshi; OKUBO, Waki; MATSUMI, Tatsuya

Pub. Number AU-A-2002346237

PCT Number PCT/JP02/06557

PCT Pub. Number WO2003/003121

Priority 2001-239110 07.08.01 JP; 2001-316025 12.10.01 JP; 2001-347737 13.11.01 JP; 2001-196069 28.06.01 JP

Filing date 28 June 2002

Wipo publication date 3 March 2003

International Classifications

G03F 007/039 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces - Macromolecular compounds which are photodegradable, e.g. positive electron resists

H01L 021/027 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

6 March 2003 Complete Application Filed

  Priority application(s): 2001-239110 07.08.01 JP; 2001-316025 12.10.01 JP; 2001-347737 13.11.01 JP; 2001-196069 28.06.01 JP

15 May 2003 Application Open to Public Inspection

  Published as AU-A-2002346237

18 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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