CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD HAVING A RETAINING RING WITH A CONTOURED SURFACE

Details for Australian Patent Application No. 2002345427 (hide)

Owner MULTI PLANAR TECHNOLOGIES, INC.

Inventors KAJIWARA, Jiro; MOLONEY, Gerard, S.; WANG, Huey-Ming; YANG, Junsheng

Pub. Number AU-A-2002345427

PCT Number PCT/US02/17080

PCT Pub. Number WO2002/098608

Priority 09/874,174 04.06.01 US

Filing date 31 May 2002

Wipo publication date 16 December 2002

International Classifications

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

Event Publications

6 March 2003 Complete Application Filed

  Priority application(s): 09/874,174 04.06.01 US

8 May 2003 Application Open to Public Inspection

  Published as AU-A-2002345427

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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