METHODS AND APPARATUS FOR ELECTRICAL, MECHANICAL AND/OR CHEMICAL REMOVAL OF CONDUCTIVE MATERIAL FROM A MICROELECTRONIC SUBSTRATE

Details for Australian Patent Application No. 2002344838 (hide)

Owner MICRON TECHNOLOGY, INC.

Inventors LEE, Whonchee; MEIKLE, Scott G.; MOORE, Scott E.; DOAN, Trung T.

Pub. Number AU-A-2002344838

PCT Number PCT/US02/19495

PCT Pub. Number WO2003/001581

Priority 09/888,084 21.06.01 US; 09/887,767 21.06.01 US; 09/888,002 21.06.01 US

Filing date 20 June 2002

Wipo publication date 8 January 2003

International Classifications

H01L 021/321 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B24B 037/04 Lapping machines or devices, i.e. requiring pulverulent abrading substances inserted between a lap of relatively soft but rigid material and the surface to be lapped - designed for working plane surfaces

Event Publications

6 March 2003 Complete Application Filed

  Priority application(s): 09/888,084 21.06.01 US; 09/887,767 21.06.01 US; 09/888,002 21.06.01 US

19 June 2003 Application Open to Public Inspection

  Published as AU-A-2002344838

11 March 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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