Floor laying material, piece mat, and arranging structure thereof

Details for Australian Patent Application No. 2002343969 (hide)

Owner Hayashi Engineering Inc.

Inventors Nakamura, Toshiyuki; Imamura, Masahito

Agent Phillips Ormonde Fitzpatrick

Pub. Number AU-B-2002343969

PCT Number PCT/JP02/10540

PCT Pub. Number WO2003/060875

Priority 2002-003327 10.01.02 JP

Filing date 10 October 2002

Wipo publication date 30 July 2003

Acceptance publication date 3 January 2008

International Classifications

G10K 11/16 (2006.01) Methods or devices for transmitting, conducting or directing sound in general

B32B 5/26 (2006.01) Layered products characterised by the non-homogeneity or physical structure of a layer

B32B 7/02 (2006.01) Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers - in respect of physical properties, e.g. hardness

B32B 7/14 (2006.01) Layered products characterised by the relation between layers, i.e. products essentially comprising layers having different physical properties or products characterised by the interconnection of layers - applied in stripes or other spaced arrangement

B60N 3/04 (2006.01) Arrangements or adaptations of other passenger fittings, not otherwise provided for - of floor mats

B60R 13/08 (2006.01) Elements for body-finishing, identifying, or decorating - Insulating elements, e.g. for sound insulation

D06N 7/00 (2006.01) Flexible sheet materials not otherwise provided for, e.g. textile threads, filaments, yarns or tow, glued on macromolecular material

G10K 11/162 (2006.01) Methods or devices for transmitting, conducting or directing sound in general

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 2002-003327 10.01.02 JP

4 September 2003 Application Open to Public Inspection

  Published as AU-B-2002343969

3 January 2008 Application Accepted

  Published as AU-B-2002343969

1 May 2008 Standard Patent Sealed

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