POLISHING FLUID AND POLISHING METHOD

Details for Australian Patent Application No. 2002343807 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors SASAKI, Shouichi; AMANOKURA, Jin; SAKURADA, Takafumi; ANZAI, Sou; FUKASAWA, Masato

Pub. Number AU-A-2002343807

PCT Number PCT/JP02/11370

PCT Pub. Number WO2003/038883

Priority 2002-10280 18.01.02 JP; 2002-160181 31.05.02 JP; 2001-334376 31.10.01 JP

Filing date 31 October 2002

Wipo publication date 12 May 2003

International Classifications

H01L 021/304 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 2002-10280 18.01.02 JP; 2002-160181 31.05.02 JP; 2001-334376 31.10.01 JP

10 July 2003 Application Open to Public Inspection

  Published as AU-A-2002343807

15 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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