CONVENIENT METHOD AND APPARATUS FOR ANALYZING SOLDER COMPONENT

Details for Australian Patent Application No. 2002343778 (hide)

Owner F AND S LTD.

Inventors YOKOI, Shigemi

Pub. Number AU-A-2002343778

PCT Number PCT/JP02/11858

PCT Pub. Number WO2004/044577

Filing date 14 November 2002

Wipo publication date 3 June 2004

International Classifications

G01N 033/20 Investigating or analysing materials by specific methods not covered by groups - Metals

B23K 001/00 Soldering, e.g. brazing, or unsoldering

B23K 001/08 Soldering, e.g. brazing, or unsoldering - Soldering by means of dipping in molten solder

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

27 February 2003 Complete Application Filed

8 July 2004 Application Open to Public Inspection

  Published as AU-A-2002343778

28 July 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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