HIGH-DENSITY INTERCONNECTION OF TEMPERATURE SENSITIVE ELECTRONIC DEVICES

Details for Australian Patent Application No. 2002343595 (hide)

Owner BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventors ERIKSON, Kenneth, R.; MARCINIEC, John, W.

Pub. Number AU-A-2002343595

PCT Number PCT/US02/34948

PCT Pub. Number WO2004/013698

Priority 60/401,017 02.08.02 US

Filing date 31 October 2002

Wipo publication date 23 February 2004

International Classifications

G03F 007/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 60/401,017 02.08.02 US

1 April 2004 Application Open to Public Inspection

  Published as AU-A-2002343595

21 April 2005 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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