A WIRE BONDER FOR BALL BONDING INSULATED WIRE AND METHOD OF USING SAME

Details for Australian Patent Application No. 2002342475 (hide)

Owner MICROBONDS, INC.

Inventors LYN, Robert, J.; PERSIC, John, I.; SONG, Young-Kyu

Pub. Number AU-A-2002342475

PCT Number PCT/CA02/01770

PCT Pub. Number WO2003/043774

Priority 2,363,409 20.11.01 CA

Filing date 19 November 2002

Wipo publication date 10 June 2003

International Classifications

B23K 020/00 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 021/607 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B23K 020/10 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating - making use of vibrations, e.g. ultrasonic welding

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 2,363,409 20.11.01 CA

21 August 2003 Application Open to Public Inspection

  Published as AU-A-2002342475

5 August 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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