THIN THERMALLY ENHANCED FLIP CHIP IN A LEADED MOLDED PACKAGE

Details for Australian Patent Application No. 2002342103 (hide)

Owner FAIRCHILD SEMICONDUCTOR CORPORATION

Inventors JOSHI, Rajeev; WU, Chung-Lin

Pub. Number AU-A-2002342103

PCT Number PCT/US02/33903

PCT Pub. Number WO2003/036717

Priority 60/349,260 22.10.01 US; 60/352,642 29.01.02 US; 10/271,654 14.10.02 US

Filing date 21 October 2002

Wipo publication date 6 May 2003

International Classifications

H01L 023/495 Details of semiconductor or other solid state devices

H01L 023/48 Details of semiconductor or other solid state devices - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

H01L 023/52 Details of semiconductor or other solid state devices - Arrangements for conducting electric current within the device in operation from one component to another

H01L 029/40 Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier - Electrodes

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 60/349,260 22.10.01 US; 60/352,642 29.01.02 US; 10/271,654 14.10.02 US

3 July 2003 Application Open to Public Inspection

  Published as AU-A-2002342103

8 July 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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