A STACKED MULTI-LAYER MODULE AND METHODS OF SIDE CONNECTION THERETO AND OF MANUFACTURING

Details for Australian Patent Application No. 2002341352 (hide)

Owner MEMLINK LTD.

Inventors KRIMAN, Moshe; YOFIS, Boris; GRIDISH, Yaakov

Pub. Number AU-A-2002341352

PCT Number PCT/IL02/00748

PCT Pub. Number WO2003/024169

Priority 60/317,950 10.09.01 US; 60/393,319 03.07.02 US

Filing date 10 September 2002

Wipo publication date 24 March 2003

International Classifications

H05K 001/11 Printed circuits - Printed elements for providing electric connections to or between printed circuits

H05K 003/34 Apparatus or processes for manufacturing printed circuits - by soldering

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 60/317,950 10.09.01 US; 60/393,319 03.07.02 US

19 June 2003 Application Open to Public Inspection

  Published as AU-A-2002341352

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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