METHOD FOR CREATING ADHESION DURING FABRICATION OF ELECTRONIC DEVICES

Details for Australian Patent Application No. 2002339981 (hide)

Owner DOW CORNING CORPORATION

Inventors CHAUDHURY, Manoj; GOODWIN, Andrew; LEE, Yeong; PARBHOO, Bhukandas

Pub. Number AU-A-2002339981

PCT Number PCT/US02/29990

PCT Pub. Number WO2003/041130

Priority 09/973,498 09.10.01 US

Filing date 20 September 2002

Wipo publication date 19 May 2003

International Classifications

H01L 021/00 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 09/973,498 09.10.01 US

24 July 2003 Application Open to Public Inspection

  Published as AU-A-2002339981

24 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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