SURFACE MOUNT ATTACHABLE LAND GRID ARRAY CONNECTOR AND METHOD OF FORMING SAME

Details for Australian Patent Application No. 2002339931 (hide)

Owner HIGH CONNECTION DENSITY, INC.

Inventors ALI, Hassan, O.; CHIANG, Shinwu; FAN, Zhineng; LE, Ai, D.; LI, Che-Yu

Pub. Number AU-A-2002339931

PCT Number PCT/US02/29233

PCT Pub. Number WO2003/065509

Priority 10/060,749 29.01.02 US

Filing date 13 September 2002

Wipo publication date 2 September 2003

International Classifications

H01R 012/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks

Event Publications

27 February 2003 Complete Application Filed

  Priority application(s): 10/060,749 29.01.02 US

18 September 2003 Application Open to Public Inspection

  Published as AU-A-2002339931

14 October 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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