THERMOSETTING RESIN COMPOSITION WITH LOW THERMAL EXPANSION AND RESIN FILM

Details for Australian Patent Application No. 2002338035 (hide)

Owner HITACHI CHEMICAL CO., LTD.

Inventors TAKAHASHI, Atsushi; BABA, Hideo; MADARAME, Ken; NAKAKO, Hideo; TAKANO, Nozomu

Pub. Number AU-A-2002338035

PCT Number PCT/JP02/09819

PCT Pub. Number WO2003/029353

Priority 2001-291635 25.09.01 JP

Filing date 25 September 2002

Wipo publication date 14 April 2003

International Classifications

C08L 101/00 Compositions of unspecified macromolecular compounds

C08J 005/18 Manufacture of articles or shaped materials containing macromolecular substances - Manufacture of films or sheets

C08K 003/00 Use of inorganic ingredients

C08L 083/04 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only

Event Publications

20 February 2003 Complete Application Filed

  Priority application(s): 2001-291635 25.09.01 JP

26 June 2003 Application Open to Public Inspection

  Published as AU-A-2002338035

17 June 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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