COMPOSITIONS AND METHODS FOR FORMING DIELECTRIC LAYERS USING A COLLOID

Details for Australian Patent Application No. 2002337882 (hide)

Owner DOW CORNING CORPORATION

Inventors HWANG, Byung; KWAN, Kermit; LI, Zhongtao; MOYER, Eric; WANG, Sheng; WYMAN, David; ZHOU, Xiaobing

Pub. Number AU-A-2002337882

PCT Number PCT/US02/33141

PCT Pub. Number WO2003/044844

Priority 09/995,985 19.11.01 US

Filing date 16 October 2002

Wipo publication date 10 June 2003

International Classifications

H01L 021/316 Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01B 003/10 Insulators or insulating bodies characterised by the insulating materials

Event Publications

20 February 2003 Complete Application Filed

  Priority application(s): 09/995,985 19.11.01 US

21 August 2003 Application Open to Public Inspection

  Published as AU-A-2002337882

5 August 2004 Application Lapsed, Refused Or Withdrawn, Patent Ceased or Expired

  This application lapsed under section 142(2)(f)/See Reg. 8.3(3). Examination has not yet been requested or directed for this application. Note that applications or patents shown as lapsed or ceased may be restored at a later date.

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